XSYS to showcase advanced flexo plate technology at Labelexpo India 2024

XSYS, a leading global supplier of prepress and printing solutions, is pleased to confirm its presence at Labelexpo India 2024, where the company will showcase its innovative printing plate technologies for the tag & label market. Bringing the label industry together from 14 – 17 November, the trade show will take place at India Expo Centre & Mart in Greater Noida, Delhi NCR.  

Joining Labelexpo India for the first time under the XSYS banner, the company will be exhibiting on stand F38 in Hall 10.

“The label market in India is expected to grow at twice the rate of the global average, so there’s a lot of potential for flexo label printers. Our mission is to support them in taking full advantage of this great opportunity with our industry-leading prepress solutions along with our robust service offering. Naturally, this means engaging directly with the market at key events such as Labelexpo India,” said Roy Schoettle, VP XSYS APAC.

The nyloflex^® portfolio of flexographic printing plates for labels will be a highlight at the show. The nyloflex^® range is continually improved with new plate formulations designed to meet the ever-changing needs of the market, such as new types of eco substrates, higher printing speeds and expanded application reach.

One example is the versatile nyloflex^® FTV flat-top dot plate which can be used for printing not only tag & labels but also flexible packaging. Offering exceptional and consistent print quality with the finest highlight dots, the nyloflex^® FTV plate reduces complexity at the prepress stage, because it is suitable for both bank and LED exposure. Furthermore, this formulation is less prone to plate swelling and features AIF (anti-ink filling) technology enabling longer and cleaner print runs with solvent-based inks.

“We’re looking forward to discussing our celebrated nyloflex^® flexo plates and the wider XSYS portfolio, including ThermoFlexX plate imagers, Catena plate processing equipment, nyloflex^® Xpress thermal plate Processor, and rotec^® sleeves and adapters with visitors at Labelexpo India,” added Roy Schoettle, VP XSYS APAC. “As a leader in the industry with a significant installed base across Asia, we understand the great benefits of meeting face-to-face in an environment that is conducive to deep learning and beneficial knowledge sharing.” 

Pradeep Saroha, Event Director of Labelexpo India 2024 commented: “I am truly delighted to welcome XSYS as an exhibitor at Labelexpo India. The company’s cutting-edge plate, platemaking and sleeve systems are another great reason for label converters to visit the show.”

Fuente: https://xsysglobal.com/xsys-to-showcase-advanced-flexo-plate-technology-at-labelexpo-india-2024/